应用Microelectronics, contacts, surgical, high temperature
基本信息
MDLMFCD00011252
EINECS231-135-5
灵敏度Ambient temperatures.
形态≈0.0082g/m, Temper: as drawn
安全信息
TSCA是
阿法埃莎
锡颗粒, Tin granules
锡柱, Tin slug
锡箔, Tin foil
锡丝, Tin wire
钨粉, Tungsten powder
钨箔, Tungsten foil
钨网, Tungsten gauze
钨丝, Tungsten wire
钨棒, Tungsten rod
钒箔, Vanadium foil
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