Grade SpecificationsMaximum level of impurities: Sb 0.02%, As 1ppm, Cu 0.005%, Fe 0.01%, Pb 0.005%
基本信息
MDLMFCD00133862
EINECS231-141-8
安全信息
TSCA是
阿法埃莎
锡溅射靶, Tin sputtering target
钨粉, Tungsten powder
钨箔, Tungsten foil
钨网, Tungsten gauze
钨丝, Tungsten wire
钨棒, Tungsten rod
钒块, Vanadium slug
钒线, Vanadium wire
镱箔, Ytterbium foil
钇箔, Yttrium foil
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