应用
Step soldering involving temperature sensitive components, Soldering to molded interconnect device (MID) plastics, Fusible alloys/fuse applications, Mercury replacement, Thermal and electrical conductivity.

备注
Keep container tightly sealed. Store in cool, dry conditions in well sealed containers.

基本信息

MDL
MFCD00144387

EINECS
231-163-8

分子式
Ga:In; 40:60 wt%

灵敏度
Ambient temperatures.

形态
Solid

溶解性
Insoluble in water.

安全信息

TSCA
是