应用
Tungsten silicide is used in microelectronics as a contact material. It is also used as a shunt over polysilicon lines to increase their conductivity and increase signal speed. Further, it acts as a barrier layer between silicon and other metals. In addition to this, it is used in microelectro mechanical systems and for oxidation-resistant coatings. It is also employed as a replacement for earlier tungsten films.

备注
Incompatible with acids.

基本信息

MDL
MFCD00049704

EINECS
234-909-0

分子式
WSi₂

分子量
240.02

熔点
2165°

灵敏度
Ambient temperatures.

形态
-325 Mesh Powder

溶解性
Insoluble in water.

安全信息

TSCA
是